Modification and Characterization of Interfacial Bonding for Thermal Management of Ruthenium Interconnects in Next-Generation Very-Large-Scale Integration Circuits
| Author(s) | Tianzhuo Zhan, Keita Sahara, Haruki Takeuchi, Ryo Yokogawa, Kaito Oda, Zhicheng Jin, Shikang Deng, Motohiro Tomita, Yen-Ju Wu, Yibin Xu, Takeo Matsuki, Haidong Wang, Mengjie Song, Sujun Guan, Atsushi Ogura, Takanobu Watanabe. |
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| Journal title | ACS Applied Materials & Interfaces 14 [5] 7392-7404 ISSN: 19448252, 19448244 ESI category: MATERIALS SCIENCE |
| Publisher | American Chemical Society (ACS) |
| Year of publication | 2022 |
| Language | English |
| DOI | https://doi.org/10.1021/acsami.1c20366 |
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