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Modification and Characterization of Interfacial Bonding for Thermal Management of Ruthenium Interconnects in Next-Generation Very-Large-Scale Integration Circuits

Tianzhuo Zhan, Keita Sahara, Haruki Takeuchi, Ryo Yokogawa, Kaito Oda, Zhicheng Jin, Shikang Deng, Motohiro Tomita, Yen-Ju Wu, Yibin Xu, Takeo Matsuki, Haidong Wang, Mengjie Song, Sujun Guan, Atsushi Ogura, Takanobu Watanabe.

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Fulltext and dataset(s) on Materials Data Repository (MDR)


    Created at: 2022-03-02 03:24:56 +0900Updated at: 2024-06-04 09:38:39 +0900

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