SAMURAI - NIMS Researchers Database

HOME > Article > Detail

Cross-Sectional analysis of the interface between Sn-Ag-Cu solder alloy and substrate in TEM
(Su-Ag-Cu系はんだと基板接合界面の断面の構造解析)


NIMS author(s)


Fulltext and dataset(s) on Materials Data Repository (MDR)


    Created at: 2022-11-15 00:40:22 +0900Updated at: 2022-11-15 00:40:22 +0900

    ▲ Go to the top of this page