Tailoring the thermoelectric and structural properties of Cu–Sn based thiospinel compounds [CuM1+xSn1−xS4 (M = Ti, V, Cr, Co)]
| Author(s) | Cédric Bourgès, Bhuvanesh Srinivasan, Bruno Fontaine, Philipp Sauerschnig, Alizée Minard, Jean-François Halet, Yuzuru Miyazaki, David Berthebaud, Takao Mori. |
|---|---|
| Journal title | Journal of Materials Chemistry C ISSN: 20507526 ESI category: MATERIALS SCIENCE |
| Publisher | Royal Society of Chemistry (RSC) |
| Year of publication | 2020 |
| Language | English |
| DOI | https://doi.org/10.1039/d0tc04393a |
| Import this reference to Mendeley |  |