Tailoring the thermoelectric and structural properties of Cu–Sn based thiospinel compounds [CuM1+xSn1−xS4 (M = Ti, V, Cr, Co)] | SAMURAI, NIMS Researchers Directory Service

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Tailoring the thermoelectric and structural properties of Cu–Sn based thiospinel compounds [CuM1+xSn1−xS4 (M = Ti, V, Cr, Co)]

Cédric Bourgès, Bhuvanesh Srinivasan, Bruno Fontaine, Philipp Sauerschnig, Alizée Minard, Jean-François Halet, Yuzuru Miyazaki, David Berthebaud, Takao Mori.

Journal of Materials Chemistry C . 2020.

https://doi.org/10.1039/d0tc04393a

NIMS author(s)

MORI, Takao

Fulltext and dataset(s) on Materials Data Repository (MDR)

Created at: 2020-12-10 03:00:19 +0900Updated at: 2024-03-31 00:24:34 +0900

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