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Combining multi-phase field simulation with neural network analysis to unravel thermomigration accelerated growth behavior of Cu6Sn5 IMC at cold side Cu–Sn interface

Anil Kunwar, Johan Hektor, Sukeharu Nomoto, Yuri Amorim Coutinho, Nele Moelans.

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Fulltext and dataset(s) on Materials Data Repository (MDR)


    Created at: 2021-05-01 03:00:18 +0900Updated at: 2024-09-05 07:36:27 +0900

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