HOME > Article > DetailCombining multi-phase field simulation with neural network analysis to unravel thermomigration accelerated growth behavior of Cu6Sn5 IMC at cold side Cu–Sn interfaceAnil Kunwar, Johan Hektor, Sukeharu Nomoto, Yuri Amorim Coutinho, Nele Moelans. International Journal of Mechanical Sciences 184 105843. 2020.https://doi.org/10.1016/j.ijmecsci.2020.105843 NIMS author(s)NOMOTO, SukeharuFulltext and dataset(s) on Materials Data Repository (MDR)Created at: 2021-05-01 03:00:18 +0900Updated at: 2024-09-05 07:36:27 +0900